ta - i technology inc. approval specifi cation sheet for ta - i doc . no tai00 4 g issued date 2012/0 7 / 1 2 p age 1 / 6 ta - i technology co., ltd led heat d issipation substrate approval specification sheet for ta i 004 g ta - i technology part number : lh a 01 a p tai00 4 g customer approval: valid date release date version j ul 12 , 2012 j ul 12 , 2012 tai 00 4 g approved by checked by produced by n0.26, lane 470, nan - shan rd., sec.2,lu - chu hsiang, taoyuan, taiwan, r. o. c. tel
ta - i technology inc. approval specifi cation sheet for ta - i doc . no tai00 4 g issued date 2012/0 7 / 1 2 p age 2 / 6 ta - i technology co., ltd 1 . specification 1 .1 substrate dimension as shown in table 1. 1 . 2 per panel up to 312 piece s . table 1 : the spec of panel and single unit item spec panel length 109.2 0.1 width 54.6 0.1 thickness of substrate 0.3 80.0 4 the total thickness 0. 5 5 0.0 6 single unit length 3.5 0.0 3 width 3.5 0.0 3 unit : mm 1 .3 specification of panel :
ta - i technology inc. approval specifi cation sheet for ta - i doc . no tai00 4 g issued date 2012/0 7 / 1 2 p age 3 / 6 ta - i technology co., ltd 2. electrical continuity test : 2.1 test point: as shown in below diagram. 2.2 me thod: use flying probe attach separately to io1 / io2 of front side and wb1/wb2 of back side, result shall as shown as table 1 and all via holes plugged. electrodes of io1/wb1 and io2/wb2 shall be isolated from each other. front side C b ond p ad a rea back s ide C non - critical a re a 2.3 table of electrical function : measurement area io1 - wb1 io2 - wb2 wb1 - wb2 io1 - io2 function of e lectrical w w : closed, w : opened wb1 wb 2 io1 io2
ta - i technology inc. approval specifi cation sheet for ta - i doc . no tai00 4 g issued date 2012/0 7 / 1 2 p age 4 / 6 ta - i technology co., ltd 3. criteria of visual inspection : 3.1 visual inspection 3.2 test item s are shown as below table. 3.3 tool: ccd om 15x 3.4 panel defective control: accept if defective /= 0.8mm front side back side 2 pattern inspection pattern of front and back side the finish pattern shall per original drawing (abo ve 95%). 3 plating layer / photoresist gap edge of bondpad area no metal / photoresist in indicated area. 4 over plating / partial plating panel filling holes ratio > 99% 5 over plating tooling hole no metal inside of th e tooling hole.
ta - i technology inc. approval specifi cation sheet for ta - i doc . no tai00 4 g issued date 2012/0 7 / 1 2 p age 5 / 6 ta - i technology co., ltd 4. coating thickness test specification : 4.1 using tools substrate thickness : micrometer cu thickness : 3 axis microscope final finish thickness : x - ray thickness meter cavity thickness : 3 axis microscope 4.2 measurement position: substrate thickness : position 1 cu thickness : position 2 final finish thickness : position 3 cavity thickness : position 4 4.3 i nspect spec : (tree times average of measurement) substrate thickness : 0.380.04mm cu thickness : 6 51 0 um final finish thickness : nipdau 5/ 0.1/ 0.1 um (2 - 8/ 0.05 - 0.2 5/ 0.05 - 0.25 um) cavity thickness : 1 00 2 0 um 1 2 3 1 2 3 4
ta - i technology inc. approval specifi cation sheet for ta - i doc . no tai00 4 g issued date 2012/0 7 / 1 2 p age 6 / 6 ta - i technology co., ltd 5. reliability test no. item parameter specification 1 adhesion test 1. temp. : rt 2. tool : 3m - 600 3. time : adhesive 30 seconds 4. angle : 180 ? the exterior must be no separate 2 solderability 1. temp. 2 3 55 2. time 51sec 3. solder bath composition ( ag/sn/cu=3/96.5/ 0.5%) ? coverage 90% 3 reflow 1. temp. 2 60 2. times 3 cycles ? the exterior must be no separate, crack and warpage ? maintain the electrical function. 6. notices (1) when i nspection, packaging and handling: must wear gloves a nd masks when inspect products. must wear latex gloves before unpacking products must avoid vibration, shock and stress etc. when carry products. (2) storage conditions: store under 25 5 50%10rh when sealed. the expiration date is less than 3 months wh en sealed. store under 25 5 50%10rh when unsealed. please store unsealed package in airtight containers and used up within 3 days. (3) before wire bonding please clean and preheat before wire bonding.
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